Educational video: Signal integrity simply explained

To mark the release of our connectivity solutions using USB 3.2 – a very stringent data protocol in terms of connector and cable assembly manufacturing and engineering –, we have produced an educational video (4:14) that explains the challenges of high frequency digital signals in simple terms and visuals.

Designing interconnect solutions for reliable and efficient high-speed data transmission requires expertise in cable assembly, high-performance connectors, and signal integrity simulation, testing and design.

During the design and characterization process of high-speed connectors and cable assembly solutions, engineers must address a complex combination of parameters such as impedance matching, line delay, insertion/ return loss, crosstalk and EMC shielding.

High-quality cable assembly is critical to ensure reliable and efficient data transmission, signal integrity and overall system function.

“To achieve successful high-speed data transmission from a device’s transmitter to its receiver, connectors and cables must be cross-optimized and undergo a series of compliance tests at the system level”, explains Ameny Chaabani, Signal Integrity Engineer at Fischer Connectors. “USB 3.2 is indeed a stringent protocol. Connector design, cable length, cable performance (loss), and the controlled and repeatable cable assembly and potting processes above 1 Gbit/s are some of the influencing parameters to consider. We must also study the full physical layer of a link as a whole, what we call system-level testing.”

As summarized in the video below, for a signal to be properly recovered at the receiver, a system must be designed so that:

• in the frequency domain, Insertion Loss, Return Loss and Crosstalk are minimized;
• in the time domain, the opening in the eye diagram is as large a possible, and the impedance is kept flat across the whole system (no impedance mismatch).

Download